Module
To lower the development threshold for users, Chipintelli has developed matching voice modules based on AI voice chips, providing integrated hardware and software solutions. Users can flexibly select the appropriate voice modules according to their product structure and positioning, enabling easy integration of voice functionality into their products.

CI13XX Series

CI13XX Series

Cost-effective Natural Speech Recognition

• CI13XX系列模块形式多样,包括端子接口、SMT贴片、金手指、USB等形式,工作电压为3.6V-5.5V,板载功放,带一路或者两路麦克风; 

• 采用启英泰伦BNPU V3,支持DNN\TDNN\RNN\CNN等神经网络及并行矢量运算,可实现语音识别、声纹识别、命令词自学习、AI声音事件检测、离线TTS及深度学习降噪等功能; 

• 采用工业级器件,可靠性高。

Module Image Module Model Technology
Specification
Buy Compatible Chip Interface Type Mics UARTs AEC Support PCB Layers Dimensions (mm) Module Status Board Scheme
CI13XX Series CI-D02GS01J

CI1302

Terminal 1 1 Yes 2 40×30 Mass Production
CI13XX Series CI-D03GS01J

CI1303

Terminal 1 1 Yes 2 40×30 Mass Production
CI13XX Series CI-D02GS02S

CI1302

SMT 1 3 Yes 2 18×20 Mass Production
CI13XX Series CI-D03GS02S

CI1303

SMT 1 3 Yes 2 18×20 Mass Production
CI13XX Series CI-D02GS04U

CI1302

USB 1 1 Yes 2 26×35 Mass Production
CI13XX Series CI-D06GT01J

CI1306

Terminal 2 1 Yes 2 40×30 Mass Production
CI13XX Series CI-D12GS10T

CI1312

Gold Finger 1 1 Yes 2 20.5×13.8 Mass Production
CI13XX Series CI-D12GS08J

CI1312

Terminal 1 1 Yes 2 40×30 Mass Production

CI13LC Series

CI13LC Series

Cost-effective Command Word Recognition

• CI13LC系列模块形式多样,包括端子接口、SMT贴片、金手指等形式,工作电压为3.6V-5.5V,板载功放,带一路麦克风、一路喇叭、一路5V电源及UART的接口; 

• 采用启英泰伦BNPU V3.5,支持DNN\TDNN\RNN\CNN等神经网络及并行矢量运算,支持离线语音识别、单麦克风降噪增强、多意图等,最多支持300条本地词条; 

• 采用工业级器件,可靠性高。

Module Image Module Model Technology
Specification
Buy Compatible Chip Interface Type Mics UARTs AEC Support PCB Layers Dimensions (mm) Module Status Board Scheme
CI13LC Series CI-F08XGS02J

CI13082V

Terminal 1 1 No 2 40×30 Mass Production
CI13LC Series CI-F162GS02J

CI13162

Terminal 1 1 No 1 40×30 Mass Production
CI13LC Series CI-F162GS02T

CI13162

Gold Finger 1 1 No 2 20.5×13.8 Mass Production
CI13LC Series CI-H162GS01J

CI13162P

Terminal 1 1 No 1 40×30 Mass Production
CI13LC Series CI-F242GS01J

CI13242

Terminal 1 1 No 2 40×30 Mass Production
CI13LC Series CI-F242GS01S

CI13242

SMT 1 3 No 2 18×20 Mass Production
CI13LC Series CI-F322GS01S

CI13322

SMT 1 3 No 2 16×11 Mass Production

CI230X Series

CI230X Series

High-performance AIoT Combo

• 智能语音AIoT模块; 

• 模块主芯片集成了启英泰伦BNPU V3以及Wi-Fi和BLE的Combo功能; 

• 系统主频可达220MHz,内置大容量 SRAM,集成 PMU 电源管理单元、双通道高性能低功耗Audio Codec和多路UART、IIC、IIS、PWM、GPIO等外围控制接口,片内集成了PA/LNA/TRX Switch。

Module Image Module Model Technology
Specification
Buy Compatible Chip Interface Type Mics UARTs AEC Support PCB Layers Dimensions (mm) Module Status Board Scheme
CI230X Series CI-E05GT02S

CI2305

SMT 2 2 Yes 4 16×24 Mass Production
CI230X Series CI-E06GT02S

CI2306

SMT 2 2 Yes 4 16×24 Mass Production
CI230X Series CI-E05GT03S

CI2305

SMT 2 2 Yes 4 18×25.5 Mass Production
CI230X Series CI-E06GT03S

CI2306

SMT 2 2 Yes 4 18×25.5 Mass Production

CI23LC Series

CI23LC Series

Cost-effective Voice recognition & BLE Combo

• CI23LC系列模块形式包括端子接口、金手指等形式,工作电压为3.6V-5.5V,板载功放,带一路麦克风; 

• 采用启英泰伦BNPU V3.5,支持DNN\TDNN\RNN\CNN等神经网络及并行矢量运算,可实现高性能离线语音识别、语音降噪等功能,具备强劲的环境噪声抑制能力;

• 集成高性能低功耗蓝牙BLE,支持小程序控制。

Module Image Module Model Technology
Specification
Buy Compatible Chip Interface Type Mics UARTs AEC Support PCB Layers Dimensions (mm) Module Status Board Scheme
CI23LC Series CI-G162GS02J

CI23162

Terminal 1 1 No 2 40×30 Mass Production
CI23LC Series CI-G162GS02T

CI23162

Gold Finger 1 1 No 2 22.1×16.2 Mass Production
CI23LC Series CI-G162GS03T

CI23162

Gold Finger 1 1 No 2 20.5×19 Mass Production
CI23LC Series CI-G242GS02J

CI23242

Terminal 1 1 No 2 40×30 Mass Production
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