CI23LC Series Low Cost AI Speech BLE Chip

<p>The CI23LC series includes CI23162 and CI23242, available in two package types: SOP16 and SSOP24. This series of chips integrates the Brain Neural Network Processor BNPU V3.5, a high-performance, low-power Bluetooth BLE system. The main frequency can reach up to 210MHz, with up to 288KByte of SRAM built-in. It also integrates a PMU power management unit and RC oscillator, a single-channel high-performance, low-power Audio Codec, and multiple peripheral control interfaces such as UART, IIC, PWM, GPIO, etc.</p>

CI23LC Series Low Cost AI Speech BLE Chip

<p>The CI23LC series includes CI23162 and CI23242, available in two package types: SOP16 and SSOP24. This series of chips integrates the Brain Neural Network Processor BNPU V3.5, a high-performance, low-power Bluetooth BLE system. The main frequency can reach up to 210MHz, with up to 288KByte of SRAM built-in. It also integrates a PMU power management unit and RC oscillator, a single-channel high-performance, low-power Audio Codec, and multiple peripheral control interfaces such as UART, IIC, PWM, GPIO, etc.</p>

产品参数english
CI23242
CI23162
参数对比English CI23242 CI23162
  • 脑神经网络处理器核(BNPU)

    · BNPU V3.5

    · Support offline NN acceleration calculation

    · VAD/low-power wake-up

    · Hardware acceleration for speech signal processing

    · BNPU V3.5

    · Support offline NN acceleration calculation

    · VAD/low-power wake-up

    · Hardware acceleration for speech signal processing

  • 语音功能

    · Support offline NN acceleration calculation

    · VAD/low-power wake-up

    · Hardware acceleration for speech signal processing

    · Front end signal processing

    √ Support local speech recognition

    √ Support adaptive noise reduction

    · Support self-learning of local command words

    · Offline far-field speech recognition, supporting 300 command words

    · Support offline NN acceleration calculation

    · VAD/low-power wake-up

    · Hardware acceleration for speech signal processing

    · Front end signal processing

    √ Support local speech recognition

    √ Support adaptive noise reduction

    · Support self-learning of local command words

    · Offline far-field speech recognition, supporting 300 command words

  • CPU主频

    · The CPU clock speed can reach 210MHz

    · The CPU clock speed can reach 210MHz

  • 存储

    · Built in 288B SRAM

    · Built in 2MB FLASH

    · Built in 288B SRAM

    · Built in 2MB FLASH

  • 集成度

    · Support external crystal oscillators

    · Built-in Bluetooth BLE 5.4

    · Support external crystal oscillators

    · Built-in Bluetooth BLE 5.4

  • 音频通道

    · Built-in high-performance, low-power Audio Codec, supporting single-channel ADC sampling and single-channel DAC playback 

    · Supports ALC function 

    · Supports sampling rates of 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz

    · Built-in high-performance, low-power Audio Codec, supporting single-channel ADC sampling and single-channel DAC playback 

    · Supports ALC function 

    · Supports sampling rates of 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz

  • 外设接口

    · 2-channel UART interface, supporting a maximum baud rate of 3Mbps 

    · 2-channel I2S interface

    · 1-channel I2C interface, capable of being externally connected to IIC devices for expansion 

    · 4-channel PWM interface, suitable for direct driving in both lighting control and motor applications 

    · Supports 11 GPIO ports, which can be used as a main control IC; each GPIO port can be configured with an interrupt function and supports configurable pull-up and pull-down settings

    · 1-channel UART interface, supporting a maximum baud rate of 3Mbps 

    · 1-channel I2C interface, capable of being externally connected to IIC devices for expansion 

    · 3-channel PWM interface, suitable for direct driving in both lighting control and motor applications 

    · Supports 3 GPIO ports, which can be used as a main control IC; each GPIO port can be configured with an interrupt function and supports configurable pull-up and pull-down settings

  • 封装

    · Packaging form: SSOP24 

    · Operating temperature range: -40℃ to 85℃

    · Packaging form: SOP16 

    · Operating temperature range: -40℃ to 85℃

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